–
|
Process:
- SMT (small components 0201)
–- Mix
Technology, SMT and bear Die
–- Chip
Packaging: die on top and leads, Pin, Ball, SMT leads on the bottom
–- BGA
Balling
–- Flip
Chip on Board and Flex
–- Hot
Bar for LCD Connection and High density flex to flex (anisotropic tape)
–- 3D
Packaging: Optical Die, MEMS, Die on Die (Patten Process)
–- Laser
Soldering: Die to Flex Bonding (Patten Process)
|
|
Copyright © 2004 MAAP TECHNOLOGY.Inc. All rights reserved. |
|
This site is best viewed using IE 6 at a screen resolution of 800 x 600. |
